Intel 10M50DAF484C7G: A Comprehensive Technical Overview of the MAX 10 FPGA

The Intel MAX 10 FPGA represents a significant evolution in non-volatile, low-cost FPGA technology, blending the high integration of an FPGA with the convenience of instant-on capability. The specific device 10M50DAF484C7G encapsulates these features in a compact, high-performance package, making it a cornerstone for a wide array of embedded applications.

As a member of the MAX® 10 family, this device is built on a 55-nm embedded flash process technology. This foundational choice is critical, as it eliminates the need for an external configuration memory chip, which is a common requirement for SRAM-based FPGAs. This integration not only reduces the total system cost and board space but also enables instant-on operation upon power-up, a vital characteristic for systems requiring immediate functionality and high reliability.

The device nomenclature, 10M50DAF484C7G, provides a detailed breakdown of its capabilities:

10: Denotes the MAX 10 family.

M: Indicates a moderate-grade speed grade.

50: Signifies that the device contains approximately 50,000 logic elements (LEs), the basic building blocks for implementing digital logic.

F: Confirms the presence of embedded flash memory.

A: Represents the specific device variant.

484: Specifies the 484-pin FineLine BGA package.

C7G: Indicates the commercial temperature grade (0°C to 85°C) and the specific speed grade.

Beyond its core logic fabric, the 10M50DAF484C7G is packed with hardened system-level features that elevate it from a simple programmable logic device to a complete "system on a chip" solution. A key highlight is its dual-configuration flash feature, which allows for robust field updates and fail-safe reconfiguration by storing two distinct images. Furthermore, it integrates analog-to-digital converters (ADC) with up to 17 channels, enabling direct interfacing with sensors and analog signals without external components.

The device also contains up to 1.6 Mb of true dual-port embedded memory (M9K blocks), which can be configured as RAM, FIFO, or ROM. For digital signal processing, it features up to 144 18 x 18 multipliers for implementing high-performance DSP algorithms. Its low-power core and support for various I/O standards, including LVCMOS, LVDS, and SSTL, make it exceptionally versatile for interfacing with other peripherals and memory devices.

Typical applications for this FPGA are vast and diverse, spanning across industrial, automotive, communications, and consumer markets. It is exceptionally well-suited for:

System Management and Power Sequencing

Sensor Fusion and Data Acquisition

Motor Control Drives

Video and Image Processing Interfaces

Reconfigurable Computing and Protocol Bridging (e.g., PCIe, USB, Ethernet)

ICGOOODFIND: The Intel 10M50DAF484C7G MAX 10 FPGA stands out as a highly integrated, cost-effective, and power-efficient solution that consolidates logic, memory, DSP, and analog capabilities into a single chip. Its non-volatile nature and instant-on features provide a significant advantage for space-constrained and reliability-focused designs, solidifying its role as a pivotal enabling technology for modern embedded systems.

Keywords: Non-Volatile FPGA, Instant-On Operation, Embedded Flash, 50K Logic Elements, System Integration