ON Semiconductor Solutions on ICGOODFIND SiteMap
最新文章
- TL323X Debuts at IOTE 2026 Shenzhen – Telink’s Multi‑Protocol Wireless SoC for IoT
- 700V Half-Bridge GaN IC Cuts Motor Drive Size for 220V Variable-Frequency Home Appliances
- SK Hynix Restarts Dalian Fab 2 – 50% NAND Capacity Boost by 2027
- TSMC in Talks to Buy Two AUO Panel Fabs for $210M – Panel-Level Packaging Push
- Apple Tests CXMT DRAM for iPhone & MacBook – New Supplier in Play
- China Power Semi Player Kuaweitie Buys Jingyi for $230M – Big Goodwill, Big Bet
- Nokia Buys a Fab to Secure InP Optical Chips – Supply Play for AI Data Centers
- Five Domestic 60V Non-Synchronous Buck Converters – Automotive & Industrial Power Options Compared
- HP, ASUS, Acer Adopt CXMT DRAM in Small-Batch PC Production Amid Global Memory Shortage
- Renesas to Shut Down 6-Inch Takasaki Fab in 2–3 Years – Shifts Production to 8-Inch Lines
- Montage Tech Starts CXL 3.2 MXC Chip Trial Production – 64GT/s Memory Controller for AI Servers
- Samsung Q2 Profit Soars 1,814% to Record $64B – But Phone Business Posts First Loss Since 2009
- SK Hynix Q2 Net Margin Hits 118% – Revenue Surges 257% to $56.5B on AI Memory Boom
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Cadence Q2 Revenue Hits $1.58B – Backlog Surges to $8.1B as AI Agents Reshape Chip Design
- NVIDIA’s First U.S.-Made GB300 AI Chip Debuts – Fab21 4nm, but CoWoS Still Missing
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- Intel Q2 Revenue Soars 25% to $16.1B – Highest Growth in 15 Years
- ABB Acquires Advantics – Snaps Up SiC Power Conversion Tech for Data Centers & Microgrids
- SK Hynix Denies Intel Ohio Fab Acquisition – Both Firms Silence Rumor
- Google Locks Gemini Into Silicon with Frozen v2 – Targeting 10x Tokens per Watt
- Kimi K3 Designs a 146k-Cell Chip in 48 Hours – AI-Driven Silicon Validation
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- Intel 18A Yield Hits 85% – Apple, AMD, Nvidia Sign On; Foundry Revenue Set for 2030
- Tower Semiconductor Plans ¥600B Japan Investment for Silicon Photonics Fab
- Tower Semiconductor Plans ¥600B Japan Investment for Silicon Photonics Fab
- EastCore DF1000 Debuts – Software-Defined 3D Compute-in-Memory AI Chip on 14nm
- MediaTek June Revenue Ticks Up 2.8% – H1 2026 Edges Down 0.8%
- Samsung Develops GAIA – 4nm AI PC Accelerator Chip Set for 2027 Mass Production
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- onsemi NVC3S5A51PLZT1G: High-Performance, Low-Voltage SPDT Analog Switch
- Onsemi SZMM3Z3V3T1G Zener Diode: Key Features and Application Circuit Design
- onsemi TDA1085C Universal Motor Speed Controller Datasheet and Application Circuit Analysis
- onsemi STK672-632AN-E Hybrid IC Stepper Motor Driver: Datasheet, Pinout, and Application Circuit Guide
- onsemi MBRS540T3 Schottky Barrier Rectifier: Key Specifications and Application Circuit Design Considerations
- onsemi NC7WB66L8X: Ultra-Tiny Low-Voltage Dual Analog Switch/2:1 MUX
- onsemi NVMTS0D4N04CTXG: 40V, 4mΩ N-Channel MOSFET for High-Efficiency Power Conversion
- Quad 2-Input AND Gate: Datasheet and Application Guide for onsemi MC74HCT08ADTR2G
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- DDR2 Prices Soar 60% as AI Hungers Consume Legacy DRAM – Full-Category Memory Rally Intensifies
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- Micron Q3 FY2026 Revenue Hits $41.46B, AI Memory Demand Drives 1,398% Net Income Surge
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- EU Approves €76M Grant for World’s First Quantum Chip Tester Plant in Munich
- Groq Raises $650M, Shifts from Chips to AI Inference Cloud Provider
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- SiC Unicorn Basic Semiconductor Files HK IPO: $43M Revenue, $47M Loss, Backed by Bosch and Wingtech
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Samsung Pushes DSEP Platform, Targets Fully Automated Wafer Fab by 2030
- onsemi Appoints He Maojun as China VP and GM for System Products
- Top‑10 Foundries Post Record Q1 Revenue – TSMC at 72% Share, Nexchip Jumps to #8
- Hanmi Semiconductor Invests ₩50B in SpaceX Ahead of Its $1.77T Nasdaq Debut
- SK Hynix to Mass‑Produce 375‑Layer 3D NAND by Year‑End, Switches to Molybdenum for Word Lines
- Nikon Develops New Digital Lithography Tool for Advanced Packaging: 30% Higher Throughput<
- Cadence and Nvidia Debut Level‑5 Autonomous AI Chip Design Engineer: ChipStack AI Super Agent
- Diodes Expands AH371xQ Automotive Hall Latch Family for BLDC Motor Sensing
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- TSMC CEO Wei: Nanjing Fab Has No Risk, $56B CapEx for 2026, ‘Wish Elon Well’ on His Fab
- Q1 2026 DRAM Revenue Surges 81% to $97B, Contract Prices Nearly Double
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Lightmatter Joins Nvidia NVLink Fusion Ecosystem to Power AI Optical Interconnects
- Anthropic Confidentially Files for IPO at $965B Valuation, Outpacing OpenAI
- NXP CBTL05024BS: A High-Performance 8:1 Differential Passive Switch for High-Speed Signal Routing Applications
- NXP 74LVC74ABQ: A Comprehensive Technical Overview of the Dual D-Type Flip-Flop IC
- NXP LPC4088FET180: A High-Performance ARM Cortex-M4 Microcontroller for Advanced Embedded Applications
- NXP TDA8944J: A 4x11W Audio Power Amplifier for TV and Monitor Applications
- NXP PUSBM12VX4-TL: A High-Performance USB-C Power Delivery 0 Programmable Buck Controller
- NXP PMEG3002ESF: A Comprehensive Technical Overview of the Schottky Barrier Diode
- NXP PMXB56EN: A Comprehensive Technical Overview of its Architecture and Applications
- NXP TEF6730HW: A Comprehensive Technical Overview of Philips' AM/FM Front-End Receiver IC
- Samsung Overtakes Micron as No.1 in Global Automotive Memory Market
- China Big Fund Trims Stakes in NSIG, Debang, SMIC – Market Reaction Muted
- Tencent’s Canghai V1 Tops MSU Hardware Encoding Contest; V2 Set for H2 2026 Mass Production
- Guangdong Guangbao Microelectronics Faces Bankruptcy Over Unpaid Debts
- NXP 74ALVC125BQ: A Comprehensive Technical Overview of the Quad Buffer/Line Driver
- NXP BFQ540: A High-Performance NPN Silicon RF Transistor for Broadband Applications
- NXP 74HC1G04: The Single Inverter Gate IC for Space-Constrained Digital Designs
- NXP 74AUP1G240GW: A Comprehensive Technical Overview of its Features and Applications
- NXP 74LVC2G34GM: A Comprehensive Technical Overview of the Dual Buffer Gate IC
- NXP 74LVC3G17GT: Triple Schmitt-Trigger Buffer for High-Noise Immunity and Low-Power Design
- NXP 74LVC1G38GM: A Single Gate CMOS Logic Hex Inverter with Open-Drain Output
- NXP 74LVC2G38DP: A Dual 2-Input NAND Buffer Gate with Open-Drain Outputs
- Sensirion Launches STC42A Automotive Hydrogen Sensor for Battery Thermal Runaway Detection
- Asia’s March Chip Exports Surge 81% as AI Demand Drives Unprecedented Price-Volume Gap
- SiTime Elite 2 Super-TCXO Cuts AI Cluster Sync to Sub‑1ns, Boosts GPU Utilization
- TSMC’s Japan Fab JASM Turns Profitable for First Time in Q1 2026
- SMIC Q1 Sales Hit $2.505B, Gross Margin Rises to 20.1% on Pricing Power
- NXP 74HC4051BQ-Q100: A Comprehensive Overview of the Automotive-Qualified 8-Channel Analog Multiplexer/Demultiplexer
- NXP GTL2002DC125: A 2-Bit Bidirectional Voltage-Level Translator for Mixed-Voltage Systems
- NXP 74HC4067DB,118: A Comprehensive Technical Overview and Application Guide for the 16-Channel Analog/Digital Multiplexer/Demultiplexer IC
- NXP HEF40098BT: A Comprehensive Technical Overview of the 8-Bit Addressable Latch
- LPC1124JBD48/303QL: A Comprehensive Technical Overview of NXP's ARM Cortex-M0 Microcontroller
- NXP BZX84J-B5V6: A Comprehensive Technical Overview of the 6V Zener Diode
- NXP K32W041Z: A Comprehensive Overview of the Multi-Protocol Wireless MCU for Secure IoT Applications
- NXP IP4369CX4-H500: A High-Performance Power Management IC for Next-Generation Mobile Devices
- Sony and TSMC Join Forces on 3nm Autonomous Driving Chip
- Iran Conflict Sparks 40% Monthly Surge in PCB Prices as Key Resin Supply Disrupted
- Cadence Expands TSMC Collaboration to Accelerate AI Chip Design Across N3 to A14
- NXP BFU630F: A Comprehensive Technical Overview of the 28 V Silicon Germanium RF Bipolar Transistor