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- Samsung Pushes DSEP Platform, Targets Fully Automated Wafer Fab by 2030
- onsemi Appoints He Maojun as China VP and GM for System Products
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- Hanmi Semiconductor Invests ₩50B in SpaceX Ahead of Its $1.77T Nasdaq Debut
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- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
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- Q1 2026 DRAM Revenue Surges 81% to $97B, Contract Prices Nearly Double
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Lightmatter Joins Nvidia NVLink Fusion Ecosystem to Power AI Optical Interconnects
- Anthropic Confidentially Files for IPO at $965B Valuation, Outpacing OpenAI
- NXP CBTL05024BS: A High-Performance 8:1 Differential Passive Switch for High-Speed Signal Routing Applications
- NXP 74LVC74ABQ: A Comprehensive Technical Overview of the Dual D-Type Flip-Flop IC
- NXP LPC4088FET180: A High-Performance ARM Cortex-M4 Microcontroller for Advanced Embedded Applications
- NXP TDA8944J: A 4x11W Audio Power Amplifier for TV and Monitor Applications
- NXP PUSBM12VX4-TL: A High-Performance USB-C Power Delivery 0 Programmable Buck Controller
- NXP PMEG3002ESF: A Comprehensive Technical Overview of the Schottky Barrier Diode
- NXP PMXB56EN: A Comprehensive Technical Overview of its Architecture and Applications
- NXP TEF6730HW: A Comprehensive Technical Overview of Philips' AM/FM Front-End Receiver IC
- Samsung Overtakes Micron as No.1 in Global Automotive Memory Market
- China Big Fund Trims Stakes in NSIG, Debang, SMIC – Market Reaction Muted
- Tencent’s Canghai V1 Tops MSU Hardware Encoding Contest; V2 Set for H2 2026 Mass Production
- Guangdong Guangbao Microelectronics Faces Bankruptcy Over Unpaid Debts
- NXP 74ALVC125BQ: A Comprehensive Technical Overview of the Quad Buffer/Line Driver
- NXP BFQ540: A High-Performance NPN Silicon RF Transistor for Broadband Applications
- NXP 74HC1G04: The Single Inverter Gate IC for Space-Constrained Digital Designs
- NXP 74AUP1G240GW: A Comprehensive Technical Overview of its Features and Applications
- NXP 74LVC2G34GM: A Comprehensive Technical Overview of the Dual Buffer Gate IC
- NXP 74LVC3G17GT: Triple Schmitt-Trigger Buffer for High-Noise Immunity and Low-Power Design
- NXP 74LVC1G38GM: A Single Gate CMOS Logic Hex Inverter with Open-Drain Output
- NXP 74LVC2G38DP: A Dual 2-Input NAND Buffer Gate with Open-Drain Outputs
- Sensirion Launches STC42A Automotive Hydrogen Sensor for Battery Thermal Runaway Detection
- Asia’s March Chip Exports Surge 81% as AI Demand Drives Unprecedented Price-Volume Gap
- SiTime Elite 2 Super-TCXO Cuts AI Cluster Sync to Sub‑1ns, Boosts GPU Utilization
- TSMC’s Japan Fab JASM Turns Profitable for First Time in Q1 2026
- SMIC Q1 Sales Hit $2.505B, Gross Margin Rises to 20.1% on Pricing Power
- NXP 74HC4051BQ-Q100: A Comprehensive Overview of the Automotive-Qualified 8-Channel Analog Multiplexer/Demultiplexer
- NXP GTL2002DC125: A 2-Bit Bidirectional Voltage-Level Translator for Mixed-Voltage Systems
- NXP 74HC4067DB,118: A Comprehensive Technical Overview and Application Guide for the 16-Channel Analog/Digital Multiplexer/Demultiplexer IC
- NXP HEF40098BT: A Comprehensive Technical Overview of the 8-Bit Addressable Latch
- LPC1124JBD48/303QL: A Comprehensive Technical Overview of NXP's ARM Cortex-M0 Microcontroller
- NXP BZX84J-B5V6: A Comprehensive Technical Overview of the 6V Zener Diode
- NXP K32W041Z: A Comprehensive Overview of the Multi-Protocol Wireless MCU for Secure IoT Applications
- NXP IP4369CX4-H500: A High-Performance Power Management IC for Next-Generation Mobile Devices
- Sony and TSMC Join Forces on 3nm Autonomous Driving Chip
- Iran Conflict Sparks 40% Monthly Surge in PCB Prices as Key Resin Supply Disrupted
- Cadence Expands TSMC Collaboration to Accelerate AI Chip Design Across N3 to A14
- NXP BFU630F: A Comprehensive Technical Overview of the 28 V Silicon Germanium RF Bipolar Transistor
- NXP BUK765R0-100E: A High-Performance 100V TrenchMOS Power MOSFET for Advanced Automotive and Industrial Applications
- NXP PSMN102-200Y: A High-Performance Power MOSFET for Demanding Applications
- NXP TJA1021T/10/C LIN Transceiver: Key Features, Applications, and Design Considerations
- NXP MC33771BTP1AE: A Comprehensive Overview of its Features and Applications in Automotive Battery Management Systems
- NXP PMEG4020EP: A High-Performance 40V, 2A Power Schottky Barrier Rectifier
- NXP MC9S08QD4MSC: An In-Depth Technical Overview of the 8-bit HCS08 Microcontroller
- NXP S9S08DZ60F2MLHR: An In-Depth Technical Overview of the 8-bit HCS08 Microcontroller
- Chinese GPU Maker Xiangdixian Secures New Funding, Moves Toward IPO
- China’s 001298 Acquires Shenzhen Dingruixin for $8.4M Cash, Gains 100% Stake
- AltoBeam 3rd‑Gen Wi‑Fi 6 Chip ATBM6062D – 28nm & SDIO 3.0
- VIS Kicks Off Phase 2 Expansion for Singapore VSMC Fab – Phase 1 Fully Sold Out
- NXP BYC10-600: A Comprehensive Technical Overview of the 10A, 600V Ultrafast Rectifier
- NXP P2040NSN7MMC: A Comprehensive Technical Overview of the QorIQ P2040 Quad-Core Processor
- NXP S9KEAZN32ACLC: A Comprehensive Technical Overview of the 32-bit KEA Automotive Microcontroller
- NXP PMEG10020AELR: A Comprehensive Technical Overview of the 100V, 20A Schottky Barrier Rectifier
- NXP 74HC1G125GV: A Comprehensive Technical Overview of the Single Bus Buffer Gate
- Unveiling the NXP S912ZVML32F3WKHR: A High-Performance 32-Bit Automotive Microcontroller
- NXP LX2160SE72232B: A High-Performance 16-Core Processor for Advanced Networking and Edge Infrastructure
- MCIMX7D7DVM10SD: NXP's High-Performance i.MX 7Dual Processor for Advanced Embedded Applications
- Memsensing Turns Profitable in 2025 – Revenue Hits $86M, Up 22.7%
- NXP PN7150B0HN/C11002Y: A Comprehensive Technical Overview of the High-Performance NFC Controller
- NXP LPC2294HBD144/01: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP BFT92W: A Comprehensive Technical Overview of the PNP Silicon Planar RF Transistor
- NXP MCIMX6X4CVM08AC: A Comprehensive Technical Overview of the i.MX 6 Series Applications Processor
- NXP TJA1049T/3: A High-Performance CAN FD Transceiver for Robust Automotive Networks
- NXP TJA1051T/3/1J: A High-Speed CAN Transceiver for Robust Network Performance
- NXP MCIMX6S6AVM08AD: A Comprehensive Technical Overview of the i.MX 6 Series Application Processor
- NXP PMEG3010ER: A Comprehensive Technical Overview of its Key Features and Applications
- Unigroup Invests $770M to Raise H3C Stake – Tightening Grip on AI Compute
- GigaDevice Launches GD32F5HC MCU – Small Size, High Security, 200MHz Arm Cortex-M33
- Texas Instruments Q1 Smashes Estimates – Stock Jumps 8% on Industrial & Data Center Surge
- US-JOINT Launches in Silicon Valley – 12 Japanese & US Materials Giants Grab Advanced Packaging Lead
- RF Chip Leader Zhenlei Technology Gets ST Penalty for IPO-Year Fraud
- 2D NAND Prices Surge – UMC Eyes Flash Foundry Entry
- OpenAI Commits $20 Billion to Cerebras Chips in 3-Year Deal
- DapuStor Soars 429% on Debut – Shenzhen SSD Maker Hits $14B Market Cap
- Rockchip 2025 Net Profit Hits 1.04B RMB, Up 74.8% – AIoT & Auto Chips Drive Record High
- Domestic 2nm AI GPU Unveiled, Taking First Step to Break Global Monopoly
- Biwin Hit with $50M Patent Suit from Longsys Affiliate Amid IPO